Evonik presents innovative "Debonding on Demand" concept for more sustainable bonding
- New approach to debonding improves the recyclability and repairability of materials in modern manufacturing processes
- Significant loss of cohesion in 1K and 2K bonding systems after heat treatment
- Solution can be easily integrated into existing technologies
Evonik has developed a groundbreaking "Debonding on Demand" concept to meet the growing demands of today's manufacturing industry for the circular economy by improving the sustainability of bonding. This innovative technology was developed in collaboration between Evonik's strategic innovation unit and business incubator, Creavis, and the experts in advanced polyurethanes from the Comfort & Insulation Business Line and aims to meet the urgent need for adhesives that can be easily removed for recycling and repairs.
Adhesives are essential for modern manufacturing because they allow for efficient assembly, bonding of different materials, and lightweight construction. However, traditional adhesives can present challenges when it comes to repairing and recycling bonded components. Evonik's innovative debonding-on-demand technology addresses these challenges by using reversible or fissile covalent bonds as the basis of the chemical network, thus ensuring cost-effectiveness and operational efficiency. This new development is easily applicable and will complement existing debonding technologies such as stretch-and-detach or electric debonding, making it an attractive option for a wide range of industries. It has the potential to transform the circular economy by making it easier and more efficient to dismantle and recycle products.
"Despite the growing demand for removable adhesives, there have been few effective solutions on the market to facilitate the disassembly of material parts," says Dr. Nicolai Kolb, Manager Business Development at Creavis. "Our new approach is a positive step in the development of more sustainable adhesive solutions that are in line with the principles of the circular economy."
This innovative approach is compatible with existing adhesive technologies in the polyurethane sector and enables integration into existing manufacturing processes. Evonik's new debonding-on-demand concept has a low viscosity, which increases user-friendliness in various applications. It offers a flexible range of debonding temperatures (80-150°C) that is compatible with both 1K and 2K adhesive systems, making it suitable for a wide range of applications.
"The development of this groundbreaking technology comes at exactly the right time, as the adhesives market is increasingly shaped by regulatory requirements and sustainability aspects," said Dr. Christian Brandl, Technology Manager Advanced Polyurethanes, Business Line Comfort & Insulation. "We are excited about the potential of our new debonding-on-demand concept to meet these regulatory requirements by providing significant benefits in terms of material recovery, waste reduction and product longevity."
Evonik is currently working with selected players in the adhesives market to prepare market demonstrators for this innovative technology. Initial proof-of-concept trials have shown promising results indicating a significant loss of cohesion after heat treatment, further confirming the effectiveness of the debonding process.
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